Lin M. | United Microelectronics Corp. Specialty Technology Department Technology & Process Development D
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- United Microelectronics Corp. Specialty Technology Department Technology & Process Development Dの論文著者
United Microelectronics Corp. Specialty Technology Department Technology & Process Development D | 論文
- A Low Thermal-Budget High-Performanced 0.25-0.18um Merged Logic and DRAM
- Width Scaling and Layout Variation Effects on Dual Damascene Copper Interconnects Electromigration
- Copper Interconnect Electromigration Behavior in Various Structures and Precise Bimodal Fitting
- New Observations on the Narrow Width Effect of the Hot Carrier and NBTI Reliabilities in pMOSFETs with Various Types of Strains
- A Novel Shallow Trench Isolation with Mini-Spacer Technology