SHIN Kyeong | Process Engineering Dept. 5, MagnaChip Semiconductor Ltd.
スポンサーリンク
概要
関連著者
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Jeong Yang
Department Of Electrical And Semiconductor Engineering Chonnam National University
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Jeong Y
Boe-hydis Co. Ltd. Kyungki‐do Kor
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MUN Seong
Process Engineering Dept. 5, MagnaChip Semiconductor Ltd.
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SHIN Kyeong
Process Engineering Dept. 5, MagnaChip Semiconductor Ltd.
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Mun Seong
Process Engineering Dept. 5 Magnachip Semiconductor Ltd.
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Kwak J
Hanyang Univ. Seoul Kor
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KWAK Jong
Process Engineering Dept. 5, MagnaChip Semiconductor., Ltd.
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Kim Jae
Department of Anatomy, College of Medicine, Pusan National University
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KIM Dae
Department of Anatomy and Center for Advanced Medical Education by BK21 Project, Inha University Col
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Kim Dae
Department Of System Ic R&d Magnachip Semiconductor Ltd.
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Ryu Hyuk
System Ic R&d Center Hynix Electronics Industries Co. Ltd.
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Jeong Jae
Department Of Nuclear Medicine Seoul National University College Of Medicine
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Huh Sang
Process Engineering Dept. 5 Magnachip Semiconductor Ltd.
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KANG Seong
Department of Veterinary Surgery, College of Veterinary Medicine and Veterinary Medical Research Cen
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JU Je
Department of System IC R&D, Magnachip Semiconductor Ltd.
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Ju Je
Department Of System Ic R&d Magnachip Semiconductor Ltd.
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LEE Sung
Process Engineering Dept. 5, MagnaChip Semiconductor., Ltd.
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YOON Ki
Process Engineering Dept. 5, HYNIX Electronics Industries Co., Ltd.
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Shin Kyeong
Process Engineering Dept. 5 Magnachip Semiconductor Ltd.
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Mun Seong
Process Engineering Dept. 5 Hynix Electronics Industries Co. Ltd.
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Kwak Jong
Process Engineering Dept. 5 Hynix Electronics Industries Co. Ltd.
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Jeong Yang
Department Of Electrical & Semiconductor Engineering Yosu National University
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Shin Kyeong
Process Engineering Dept. 5 Hynix Electronics Industries Co. Ltd.
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Yoon Ki
Process Engineering Dept. 5 Hynix Electronics Industries Co. Ltd.
著作論文
- Layout Dependent Induced Leakage and its Prevention with Different Shallow Trench Isolation Schemes in 0.18μm Dual Gate Complementary Metal Oxide Semiconductor Technology
- Etch Defect Reduction Using SF_6/O_2 Plasma Cleaning and Optimizing Etching Recipe in Photo Resist Masked Gate Poly Silicon Etch Process
- Shallow Trench Isolation Top Corner Rounding Using Si Soft Etching Following Diluted Hydrofluorine Solution