Kwak Jong | Process Engineering Dept. 5 Hynix Electronics Industries Co. Ltd.
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概要
関連著者
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Mun Seong
Process Engineering Dept. 5 Hynix Electronics Industries Co. Ltd.
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Kwak Jong
Process Engineering Dept. 5 Hynix Electronics Industries Co. Ltd.
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Jeong Yang
Department Of Electrical & Semiconductor Engineering Yosu National University
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Shin Kyeong
Process Engineering Dept. 5 Hynix Electronics Industries Co. Ltd.
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Ryu Hyuk
System Ic R&d Center Hynix Electronics Industries Co. Ltd.
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Jeong Yang
Department Of Electrical And Semiconductor Engineering Chonnam National University
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Jeong Y
Boe-hydis Co. Ltd. Kyungki‐do Kor
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Kwak J
Hanyang Univ. Seoul Kor
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MUN Seong
Process Engineering Dept. 5, MagnaChip Semiconductor Ltd.
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SHIN Kyeong
Process Engineering Dept. 5, MagnaChip Semiconductor Ltd.
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Mun Seong
Process Engineering Dept. 5 Magnachip Semiconductor Ltd.
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KWAK Jong
Process Engineering Dept. 5, MagnaChip Semiconductor., Ltd.
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YOON Ki
Process Engineering Dept. 5, HYNIX Electronics Industries Co., Ltd.
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Shin Kyeong
Process Engineering Dept. 5 Magnachip Semiconductor Ltd.
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Lee Sung
Process Engineering Dept. 5 Magnachip Semiconductor. Ltd.
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Yoon Ki
Process Engineering Dept. 5 Hynix Electronics Industries Co. Ltd.
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Jeong Jae
Department of Electrical & Semiconductor Engineering, Yosu National University, San 96-1 Dundeck-dong, Yeosu-si, Jeollanam-do, 550-749 Korea
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Kwak Jong
Process Engineering Dept. 5, MagnaChip Semiconductor., Ltd., 1 Hyangjeong-dong, Hungduk-gu, Cheongju-si, 361-725 Korea
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Jeong Yang
Department of Electrical & Semiconductor Engineering, Yosu National University, San 96-1 Dundeck-dong, Yeosu-si, Jeollanam-do, 550-749 Korea
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Shin Kyeong
Process Engineering Dept. 5, MagnaChip Semiconductor., Ltd., 1 Hyangjeong-dong, Hungduk-gu, Cheongju-si, 361-725 Korea
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Jeong Jae
Department of Chemical and Biomolecular Engineering, and Center for Ultramicrochemical Process Systems, Korea Advanced Institute of Science and Technology, Kusong-dong, Yusong-gu, Daejon 305-701, Republic of Korea
著作論文
- Shallow Trench Isolation Top Corner Rounding Using Si Soft Etching Following Diluted Hydrofluorine Solution
- Etch Defect Reduction Using SF6/O2 Plasma Cleaning and Optimizing Etching Recipe in Photo Resist Masked Gate Poly Silicon Etch Process