YUASA S. | Anelva Corp.
スポンサーリンク
概要
Anelva Corp. | 論文
- Bottom Coverage of Cu Deposit for 200-nm-Class Circular Vias with High Aspect Ratios Investigated by Magnetron Sputtering Activated Using Superconducting Bulk Magnet
- Bottom Coverage of Cu Deposit for 200-nm-Class Circular Vias with High Aspect Ratios Investigated by Magnetron Sputtering Activated Using Superconducting Bulk Magnet
- New Ultra-High-Frequency Plasma Source for Large-Scale Etching Processes
- Variation of Radial Plasma Density Profile with the Excitation Frequency in a Magnetron-Type Plasma
- Modified Magnetron Type Plasma Source for Etching Applications