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社団法人 エレクトロニクス実装学会 | 論文
- Intention to Special Edition
- Advanced BGA/CSP and Assembling Technology. Outlook and Problem in Development of Chip Size Packages.
- Intention to the Special Edition
- Morphology Control of Electroless Copper Plating Deposit
- Trends in High Density Packaging Technologies. 2. Trends in Polymer Multilayer Boards-Future Direction of Polymer Multilayer Board Structures.:—Future Direction of Polymer Multilayer Board Structures
- Evaluation of Warp of Printed Wiring Board under Reflow Soldering.
- A Product Testing Method on a Parallel and Distributed System
- Flip Chip Assembly for Smart Card Manufactueing.
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- Equipment and Automation Technology-Current State and Future Problems. Optical Inspection.
- Multi-Chip and Bare Chip Packaging Technologies. Multi Chip Module with Utilizing Solder as Joint.
- Special Articles: The Problem of Evaluation of Insulation Reliability for Printed Circuit Boards. Measurement Techniques of Dielectric Characteristics Suitable for Electrical Insulating Materials Used for Printed Circuit Boards and Their Application to th
- An Accurate Method for Measuring Propagation Constant of Transmission Lines Embedded in Multilayer Printed Circuit Boards
- Mechanism of Nodule Formation in Electroless Copper Deposition.
- The Effect of Polyimide Surface Chemistry and Morphology on Critical Stress Intensity Factor.
- Development of Printed Circuit Boards Applied with Copper Paste Through-Holes.
- Thin Film Capacitor Using High Dielectric Constant Materials.
- An Impedance Analysis of Multiple Decoupling Capacitors with Series Resistors.
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- Numerical and Experimental Analysis of Resin Cracking in LSI Packages under Temperature Cyclic Loading. An Observation of Initial Site of the Edge-Delamination and the Effect of Delamination Length.:An Observation of Initial Site of the Edge-Delamination