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社団法人 エレクトロニクス実装学会 | 論文
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- Ceramic Printed Circuit Board Material.
- The Conduction Mechanism and Characteristics of the RuO2/CB System Thick-Film Resistors.
- Design Concept of the Latest System Packaging. The Latest Activities of Industrial Standardization and Technology Roadmap on High-Density Mounting Field.
- Chromium Free Alternative Etching Treatment for Plating on ABS Resin Using TiO2 as Photocatalyst
- Recent Progress of EMI Reduction Technology on Printed Circuit Board. Reducting of EMI by Resistor.
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- Is It Impossible to Use COPNA-Resin for PWB?
- Trend of BGACSPKGD. The Reliability of CSP/BGA Packaging Based on Simulation.
- Frequency Doubling in Corona-Poled Glass Film Waveguides.
- Thick film resistors for AlN ceramics and their laser trimming technology.
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- New porcelain enameled PWB.
- Release of Solder on Printed Circuit Boards by Heating and Vibrating.
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- Evaluation on Numerical Calculation Methods for Fracture Parameters of Interfacial Delaminations in LSI Plastic Packages.
- High Performance Organic Packaging Materials. Anisotropic Conductive Materials for Flip-Chip Interconnection.
- A Rounting System for Multi-Chip Modules.
- Joint Reliability of Sn-Zn BGA
- A method for PWB pattern inspection.