A Rounting System for Multi-Chip Modules.

概要

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This paper proposes a new routing system for large multi-layer MCMs, which consists of two phases; global routing and detailed routing. Global routing phase uses a hybrid hierarchical router which is a combination of a topdown and bottomup hierarchical routers and executes routing and layer assignment simultaneously. Detailed routing phase uses a parallel processing technique based on the routing area division, and the detailed routing problem of each divided region is solved by a workstation connected by Local Area Network. The system is implemented in C language and applied to some MCNC bench mark data. The experimental results demonstrate the possibility for the system to be used for large MCM routing.
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