Development of Printed Circuit Boards Applied with Copper Paste Through-Holes.

概要

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In order to increase the circuit dencity of printed circuit boards, we developed a new type conductive through-hole ; that is copper paste TH, which is consisted of specially developed copper paste. The copper paste TH has a constraction that TH is filled with the copper paste completely and has thin copper plating layers on both sides. Therefore, mounting a surface mount component to the TH directly enable to increase circuit density. We report here that some initial specific characteristics and results of environmental tests of the copper paste THs. Electric resistance distribution was very narrow, the average was 31.4mΩ/hole (n=11520), and there were no defects (voids and cracks) . We also evaluated various environmental tests, and confirm the copper paste THs had excellent reliability, especially in thermal shock test, compared with the copper plated THs.
社団法人エレクトロニクス実装学会の論文