60% power reduction in inductive-coupling inter-chip link by current-sensing technique (Special issue: Solid state devices and materials)

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概要

• 論文の詳細を見る
• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文

著者

• INOUE Mari

  Keio University

• Miura Noriyuki

  Keio University Department Of Electronics And Electrical Engineering

関連論文

• Measurement of Inductive Coupling in Wireless Superconnect (Special Issue: Solid State Devices & Materials)
• Measurement of Inductive Coupling in Wireless Superconnect
• Constant Magnetic Field Scaling in Inductive-Coupling Data Link
• Daisy Chain Transmitter for Power Reduction in Inductive-Coupling CMOS Link(Analog and Communications,Low-Power, High-Speed LSIs and Related Technologies)
• Constant Magnetic Field Scaling in Inductive-Coupling Data Link
• 60% Power Reduction in Inductive-Coupling Inter-Chip Link by Current-Sensing Technique
• A 1.2 Gbps Non-contact 3D-Stacked Inter-Chip Data Communications Technology (Interface and Interconnect Techniques, VLSI Design Technology in the Sub-100nm Era)
• 60% power reduction in inductive-coupling inter-chip link by current-sensing technique (Special issue: Solid state devices and materials)

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