Forming Tapered Pattern by Cu Electrodeposition Through Mask on Ni Seed Layer for Thin-Film Transistors

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概要

• 論文の詳細を見る
• Japan Society of Applied Physicsの論文

著者

• Wang Yung

  Department Of Chemical Engineering National Tsing Hua University

• WAN Chi

  Department of Chemical Engineering, National Tsing Hua University

• Wan Chi

  Department Of Chemical Engineering National Tsing Hua University

関連論文

• Forming Tapered Pattern by Cu Electrodeposition Through Mask on Ni Seed Layer for Thin-Film Transistors
• Forming Tapered Pattern by Cu Electrodeposition Through Mask on Ni Seed Layer for Thin-Film Transistors
• Forming Tapered Pattern by Cu Electrodeposition Through Mask on Ni Seed Layer for Thin-Film Transistors

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