Forming Tapered Pattern by Cu Electrodeposition Through Mask on Ni Seed Layer for Thin-Film Transistors
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概要
- 論文の詳細を見る
- 2006-11-25
著者
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Wang Yung
Department Of Chemical Engineering National Tsing Hua University
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JENQ Shrane
Department of Chemical Engineering, National Tsing Hua University
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WAN Chi
Department of Chemical Engineering, National Tsing Hua University
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LI Hung
Display Institute, National Chiao Tung University
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LIU Po
Display Institute, National Chiao Tung University
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CHEN Jing
Quanta Display Inc.
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Liu Po
Display Institute National Chiao Tung University
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Li Hung
Display Institute National Chiao Tung University
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Wan Chi
Department Of Chemical Engineering National Tsing Hua University
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Jenq Shrane
Department Of Chemical Engineering National Tsing Hua University
関連論文
- Forming Tapered Pattern by Cu Electrodeposition Through Mask on Ni Seed Layer for Thin-Film Transistors
- Forming Tapered Pattern by Cu Electrodeposition Through Mask on Ni Seed Layer for Thin-Film Transistors
- Forming Tapered Pattern by Cu Electrodeposition Through Mask on Ni Seed Layer for Thin-Film Transistors