Contribution of Carbon to Activation and Diffusion of Boron in Silicon
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概要
- 論文の詳細を見る
It is well-known that the coimplantation of carbon (C) in a concentration range comparable to the range of boron (B) concentrations could suppress B diffusion, resulting in a boxlike B profile. Substitutional C atoms can capture excess self-interstitial Si atoms and suppress the diffusion of ion-implanted intersitial-type dopants such as B in silicon (Si). However, the effect of C on activation properties in wide C and B concentration ranges has not been sufficiently investigated. In this work, in the experiment in wide C and B concentration ranges, it was clarified for the first time that the B activation ratio of Si increases or decreases varies depending on the concentration of C incorporated. The activation ratio of the B activation layer was increased markedly by C incorporation in the case of light B implantation such as in the concentration range of $8\times 10^{19}$ to $3\times 10^{20}$ cm-3. This might be attributed to the interaction of C with Si interstitials and the suppression of the boron Si-interstitial clustering induced by C incorporation. In contrast, in the case of heavy B implantation such as at a $1\times 10^{21}$ cm-3 concentration, the activation ratio was decreased slightly by C incorporation. When stable B-containing clusters and precipitates were formed at high B concentrations, the effect of C incorporation on activation ratio was considered to be small.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2010-04-25
著者
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Nobutoshi Aoki
Advanced Unit Process Technology Department, Device Process Development Center, Corporate Research and Development Center, Toshiba Corporation, 8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan
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Itokawa Hiroshi
Advanced Unit Process Technology Department, Device Process Development Center, Corporate Research and Development Center, Toshiba Corporation, 8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan
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Agatsuma Yuji
Department of Electrical Engineering, Nagaoka University of Technology, 1603-1 Kamitomioka, Nagaoka, Nigata 940-2188, Japan
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Aoki Nobutoshi
Advanced Unit Process Technology Department, Device Process Development Center, Corporate Research and Development Center, Toshiba Corporation, 8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan
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Naotaka Uchitomi
Department of Electrical Engineering, Nagaoka University of Technology, 1603-1 Kamitomioka, Nagaoka, Nigata 940-2188, Japan
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Ichiro Mizushima
Advanced Unit Process Technology Department, Device Process Development Center, Corporate Research and Development Center, Toshiba Corporation, 8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan
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Hiroshi Itokawa
Advanced Unit Process Technology Department, Device Process Development Center, Corporate Research and Development Center, Toshiba Corporation, 8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan
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Ichiro Mizushima
Advanced Microelectronics Center, Toshiba Corp., Shinsugita-cho, Isogo-ku, Yokohama 235-8582, Japan
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Yuji Agatsuma
Department of Electrical Engineering, Nagaoka University of Technology, 1603-1 Kamitomioka, Nagaoka, Nigata 940-2188, Japan
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