Studies of the Photo Acid Generator Material Design for Chemically Amplified Photoresists
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概要
- 論文の詳細を見る
In current optical lithography, resolution is required to reach for 45 nm half-pitch and a chemically amplified resist (CAR) is used for a wide variety of applications. For ArF lithography beyond the 45 nm half-pitch, it is important to control pattern quality. The molecular design of a photo acid generator (PAG) is very important in the study to control not only acid strength but also acid diffusion length. Various novel PAGs that have different characteristics were synthesized for resist performance improvement. Acid molecular size was determined by molecular orbital (MO) calculation, and the acid diffusion coefficients ($D$) of these PAGs were evaluated by a bilayer method. As a result, it was found that acid diffusion coefficient ($D$) could not be controlled simply by adjusting anion molecular size. It may be presumed that the molecular interaction between acid generated by the exposure and polymer matrix areas is one of the most important key factors for controlling acid diffusion.
- 2009-06-25
著者
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Hada Hideo
Tokyo Ohka Kogyo Co. Ltd.
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Onodera Junichi
Tokyo Ohka Kogyo Co. Ltd.
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Komuro Yoshitaka
Tokyo Ohka Kogyo Co., Ltd., 1590 Tabata, Samukawa, Kanagawa 253-0114, Japan
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Kawaue Akiya
Tokyo Ohka Kogyo Co., Ltd., 1590 Tabata, Samukawa, Kanagawa 253-0114, Japan
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Utsumi Yoshiyuki
Tokyo Ohka Kogyo Co., Ltd., 1590 Tabata, Samukawa, Kanagawa 253-0114, Japan
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Seshimo Takehiro
Tokyo Ohka Kogyo Co., Ltd., 1590 Tabata, Samukawa, Kanagawa 253-0114, Japan
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Ishiduka Keita
Tokyo Ohka Kogyo Co., Ltd., 1590 Tabata, Samukawa, Kanagawa 253-0114, Japan
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Matsuzawa Kensuke
Tokyo Ohka Kogyo Co., Ltd., 1590 Tabata, Samukawa, Kanagawa 253-0114, Japan
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UTSUMI Yoshiyuki
Tokyo Ohka Kogyo Co., Ltd.
関連論文
- X-ray Reflectivity Study on Depth Profile of Acid Generator Distribution in Chemically Amplified Resists
- Enhancement of Acid Production in Chemically Amplified Resist for Extreme Ultraviolet Lithography
- Decomposition and Roughness Analysis of Chemically Amplified Molecular Resist for Reducing Line Width Roughness
- Decomposition Analysis of Chemically Amplified Resists for Improving Critical Dimension Control
- Studies of the Photo Acid Generator Material Design for Chemically Amplified Photoresists
- Low-$E_{\text{a}}$ Chemical Amplification Resists for 193 nm Lithography
- Reactivity of Halogenated Resist Polymer with Low-Energy Electrons
- Effect of Molecular Structure on Depth Profile of Acid Generator Distribution in Chemically Amplified Resist Films
- Electron and Hole Transfer in Anion-Bound Chemically Amplified Resists Used in Extreme Ultraviolet Lithography
- Electron and Hole Transfer in Anion-Bound Chemically Amplified Resists Used in Extreme Ultraviolet Lithography