Chemical Mechanical Planarization Method for Thick Copper Films of Micro-Electro-Mechanical Systems and Integrated Circuits
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概要
- 論文の詳細を見る
Modern industries require more accurate and high power-efficient micro-electro-mechanical systems (MEMS) and integrated circuits (ICs). Because the structure of MEMS and ICs becomes complicated, chemical mechanical planarization (CMP) has been introduced to fabricate highly integrated electro-mechanical structures. This study aims to reduce dishing and erosion using a negative photoresist (PR) as a protective layer in CMP for thick copper. After bulk copper CMP, soft-landing was carried out using an acidic copper CMP slurry. Method I was the CMP of a thick copper pattern without a negative PR, and method II was a new concept for the CMP method which removed the copper and negative PR to reduce the amount of copper dishing and erosion. In comparison with method I, method II reduced the dishing and erosion by about 46 and 60%, respectively.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2008-07-25
著者
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Lee Hyunseop
Graduate School of Mechanical Engineering, Pusan National University, Busan 609-735, Korea
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Jeong Haedo
Graduate School of Mechanical Engineering, Pusan National University, Busan 609-735, Korea
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Joo Sukbae
Graduate School of Mechanical Engineering, Pusan National University, San 30, Changjeon-dong, Kumjeong-gu, Busan 609-735, Korea
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Kim Hyoungjae
Busan R&D Center, Korea Institute of Industrial Technology, #208, BS-DITIC, 1274 Jisa-dong, Gangseo-gu, Busan 618-230, Korea
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Kim Hyoungjae
Busan R&D Center, Korea Institute of Industrial Technology, #208, BS-DITIC, 1274 Jisa-dong, Gangseo-gu, Busan 618-230, Korea
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Lee Hyunseop
Graduate School of Mechanical Engineering, Pusan National University, San 30, Changjeon-dong, Kumjeong-gu, Busan 609-735, Korea
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JEONG Haedo
Graduate school of Mechanical Engineering, Pusan National University
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Jeong Haedo
Graduate School of Mechanical Engineering, Pusan National University, San 30, Changjeon-dong, Kumjeong-gu, Busan 609-735, Korea
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