Pad Characterization and Experimental Analysis of Pad Wear Effect on Material Removal Uniformity in Chemical Mechanical Polishing
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概要
- 論文の詳細を見る
In this study, we investigated the effects of pad wear on the nonuniformity of material removal in chemical mechanical polishing (CMP). In order to verify the mechanical aspect of the material removal mechanism, pad characterization was conducted. Pad conditioning plays a key role in obtaining stable material removal during polishing. However, the polishing pad is gradually worn as conditioning proceeds during CMP. The pad profile was measured using the contact profile measuring system to analyze pad wear after each polishing run. From experimental results, the within wafer nonuniformity (WIWNU) was unstable at the initial polishing run because of the first wafer effect. In addition, the WIWNU deteriorated as determined from a polishing pad worn by conditioning. Therefore, pad wear has a significant effect on the nonuniformity of material removal in CMP.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2008-10-25
著者
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Jeong Haedo
Graduate School of Mechanical Engineering, Pusan National University, Busan 609-735, Korea
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Park Kihyun
Graduate School of Mechanical Engineering, Pusan National University, Busan 609-735, Korea
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Oh Jiheon
Graduate School of Interdisciplinary Program in Hybrid Materials Solution, Pusan National University, Busan 609-735, Korea
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JEONG Haedo
Graduate school of Mechanical Engineering, Pusan National University
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