Ferrite and copper electroless plating of photopolymerized resin for micromolding of three-dimensional structures
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概要
- 論文の詳細を見る
The electroless plating of ferrite and copper onto photopolymerized resin was investigated with the aim of fabricating three-dimensional microstructures. Evaluation by X-ray diffraction and X-ray fluorescence measurements clarified that the materials were successfully plated onto the resin mold by controlling the temperature and pH of the source solution. High-resolution optical microscope observation revealed that the 2-μm-deep pits at the surface were fully plated by the materials, demonstrating the submicron resolution of the microfabrication process. We performed the transcription of three-dimensional structures made of plated copper from a resin mold, and succeeded in the fabrication of a screw. The 40-μm-thick thread was formed accurately.
- The Japan Society of Applied Physicsの論文
- 2008-04-25
著者
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Mukai Kohki
Department Of Mechanical Engineering And Materials Science Yokohama National University
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Maruo Shoji
Department Of Mechanical Engineering And Materials Science Yokohama National University
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KITAYAMA Shinya
Department of Mechanical Engineering and Materials Science, Yokohama National University
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Yoshimura Toshiya
Department Of Imaging Science Faculty Of Engineering Chiba University
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Yoshimura Toshiya
Department of Mechanical Engineering and Materials Science, Yokohama National University, 79-5 Tokiwadai, Hodogaya-ku, Yokohama 240-8501, Japan
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Kitayama Shinya
Department of Mechanical Engineering and Materials Science, Yokohama National University, 79-5 Tokiwadai, Hodogaya-ku, Yokohama 240-8501, Japan
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