Photoresist Etching by Atmospheric Pressure Uniform-Glow Plasma
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概要
- 論文の詳細を見る
An atmospheric pressure uniform-glow plasma (APUGP) operated by radio-frequency (RF) power at 13.56 MHz has been developed for etching, cleaning, surface treatment, and deposition of thin films among others. This plasma employs a capacitive coupling electrode design and produces a stable, volumetric glow discharge in a large disc area of 150 mm diameter using argon and oxygen mixture gas at atmospheric pressure. Its electrical characteristics were obtained by simultaneous measurements of voltage and current. In addition, typical photoresist-AZ9918 films spin-coated on 4-in. silicon wafers have been etched using this plasma source, which shows promise for replacing low-pressure plasma devices for some existing applications.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2007-08-15
著者
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Zhao Lingli
Institute of Microelectronics, Chinese Academy of Science, 100029 Beijing, China
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Wang Shouguo
Academy of Opto-electronics, Chinese Academy of Science, P. O. Box 650, 100010 Beijing, China
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Xu Xiangyu
Academy of Opto-electronics, Chinese Academy of Science, P. O. Box 650, 100010 Beijing, China
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Ye Tianchun
Institute of Microelectronics, Chinese Academy of Science, 100029 Beijing, China
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Xu Xiangyu
Academy of Opto-electronics, Chinese Academy of Science, Beijing 100010, China
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Wang Shouguo
Academy of Opto-electronics, Chinese Academy of Science, Beijing 100010, China
関連論文
- Photoresist Etching by Atmospheric Pressure Uniform-Glow Plasma
- Atmospheric Pressure Plasma Enhanced Chemical Vapor Deposition of Borophosphosilicate Glass Films
- Surface Treatment of Flat Panel Display Substrates by a Uniform Large Area Glow Cold Plasma Tunnel at Atmospheric Pressure