Variable Optimization for Chemical Mechanical Polishing

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概要

• 論文の詳細を見る

• Slurry is often used in chemical mechanical polishing (CMP) as a polishing additive. When a spinning wafer carrier applies a pressure on a wafer toward a pad, the wafer carrier in the polishing process will drag the slurry sputtered on the pad into the narrow gap between the wafer and the pad. In this study, we determine the features of the slurry transports between the pad and the wafer by conducting experiments to develop a method of decreasing the nonuniformity of the polishing process. In this study, we apply experimental design methods to the statistical analysis of chemical mechanical polishing in manufacturing for each operation parameter. The four design parameters of CMP include the rotation speed of the pad, injection position, the rotation speed of the wafer, and slurry mass flow. The procedure for optimization search for the minimum object value and its corresponding input set values was validated and compared with that for the same search for the original experimental data. Performance indexes were improved. The procedure provided an easy and feasible approach to CMP system design.

• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2005-05-15

著者

• Li Ching-chung

  Department Of Computer Sciences Chung Cheng Institute Of Technology National Defense University

• Fu Ming-nan

  Department Of Industrial Engineering And Management Chin Min College

• Liao Shan-Hui

  Department of Industrial Engineering and Management Chin Min Institute of Technology, 351 Taiwan, R.O.C.

• Hou Kung-Hsu

  Department of Vehicle Engineering, Chung Cheng Institute of Technology, National Defense University, Taiwan 335, R.O.C.

• Li Ching-Chung

  Department of Computer Sciences, Chung Cheng Institute of Technology, National Defense University, Taiwan 335, R.O.C.

関連論文

• Flow Simulation for Chemical Mechanical Planarization
• Simulation Analysis and Experimental Verification of UV-LIGA Process for High-Aspect-Ratio Ni–Fe Micro-Mold Insert
• Simulation Analysis and Experimental Verification of LIGA-Like Process for Ni–Fe Micromold Insert with Taper Angle
• Slurry Transport during Chemical Mechanical Polishing
• Simulation for Velocity Measurement with Thermal Micro-flow Sensors
• Variable Optimization for Chemical Mechanical Polishing

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