Slurry Transport during Chemical Mechanical Polishing

概要

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An optical technique for flow diagnostics is developed to study the slurry transport on the surface of a pad and in an inter-pad-wafer region during chemical mechanical polishing. In this paper, we show that the variations in mean gray scale and nonuniformity with the wafer and pad rotation speeds agree in trend with the existing data of removal rate and nonuniformity for a 150 mm wafer. The simulation results of wafer-scale-averaged slurry shearing stress and nonuniformity also agree in trend with the data of mean gray scale and nonuniformity for a 200 mm wafer. The present flow diagnostics technique can be further used for the optimization of slurry injection rate and injection position to simultaneously obtain a high removal rate as well as a low nonuniformity. In this paper, we also show the optimum slurry injection rate.
Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
2005-11-15