The Effect of Backside Particles on Substrate Topography

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概要

• 論文の詳細を見る

• The presence of a particle on the backside of a wafer is commonly acknowledged to produce a deflection of the wafer when it is held on a flat surface by means of a pressure difference. We simulated this wafer topography, taking into account both elastic and plastic deformations. The simulations are backed up by experimental evidence. The results show that height variations of 100 nm can extend over several mm. At the same time, indentation and plastic deformation reduce the surface height variations to values that are orders of magnitude below those predicted in the ITRS roadmap.

• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2005-10-15

著者

• HEYNS Marc

  IMEC, Kapeldreef

• Mertens Paul

  IMEC, Kapeldreef 75, B-3001 Leuven, Belgium

• Bearda Twan

  IMEC, Kapeldreef 75, B-3001 Leuven, Belgium

• Holsteyns Frank

  IMEC, Kapeldreef 75, B-3001 Leuven, Belgium

• De Bisschop

  IMEC, Kapeldreef 75, B-3001 Leuven, Belgium

• Compen René

  ASML, De Run 6501, 5504 DR Veldhoven, The Netherlands

• van Meer

  ASML, De Run 6501, 5504 DR Veldhoven, The Netherlands

• Compen René

  ASML, De Run 6501, 5504 DR Veldhoven, The Netherlands

関連論文

• Critical Parameters for Obtaining Low Particle Densities on a Si Surface in an HF-Last Process
• Silicide Engineering to Boost Si Tunnel Transistor Drive Current
• Charge Trapping in SiOx/ZrO2 and SiOx/TiO2 Gate Dielectric Stacks
• The Effect of Backside Particles on Substrate Topography

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