Role of Ion Energy and Flux on Inductively Coupled Plasma Etch Damage in InGaN/GaN Multi Quantum Well Light Emitting Diodes
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概要
- 論文の詳細を見る
The effect of inductive coupled plasma (ICP) etching of GaN light-emitting diodes (LEDs) on the device performance was investigated. InGaN/GaN multi-quantum well LEDs with emission wavelengths 420 nm were fabricated using Cl2/Ar ICP etching to form the mesa for the n-contact. Different rf chuck powers (controlling incident ion energy) and source powers (controlling ion flux) were used to examine their effect on junction leakage current. At high ion fluxes (source powers $> 500$ W), the junctions were very heavily damaged. The forward turn-on voltage was increased by using higher ion energies from 4.55 V for 120 eV ion energy to 5.1 V for 300 eV. The reverse bias current was much less sensitive to the ion energy during plasma etching and increased only above an average ion energy of ${\sim}300$ eV. The current transport in the LEDs is dominated by generation-recombination and surface leakage components (ideality factor $\geq 2$) in all cases.
- 2005-10-15
著者
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PEARTON S.
Department of Materials Science and Engineering, University of Florida
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Han Sang
Department Of Chemical Engineering Korea Advanced Institute Of Science And Technology
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Yang Hyuck
Department of Materials Science and Engineering, University of Florida, Gainesville, FL 32611, U.S.A.
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Baik K.
Department of Materials Science and Engineering, University of Florida, Gainesville, FL 32611, U.S.A.
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Ren F.
Department of Chemical Engineering, University of Florida, Gainesville, FL 32611, U.S.A.
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