Study of Semiconductor Film Bonding Technology on Piezoelectric Substrate Using Water Glass

概要

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In this paper, we report a basic study on film bonding technology for realizing the acousto-optoelectronic integrated circuit, in which semiconductor optoelectronic devices and acousto optic devices are integrated on the piezoeletric substrate. We propose the novel film bonding technology using water glass as an adhesive material, and investigate optimum process conditions of concentration and treatment temperature of the water glass. The bonding strength between the GaAs film and piezoeletric substrate using water glass of 50 nm thickness is 4 times more than that without water glass. The stress distribution in the GaAs film with water glass is improved. We also sucessfully fabricated a simple test device consisting of an acousto optic Bragg cell and photodiode array on the LiNbO3 substrate.
Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
2003-09-15