Study of Photoacoustic Three-Dimensional Imaging by the Simultaneous Measurement of Multiple Frequencies Method
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概要
- 論文の詳細を見る
In this short note, a new technique for three-dimensional (3-D) high-speed imaging of the subsurface crack of an opaque material is proposed. First, the theoretical explanation and principle of simultaneous measurement of multiple frequencies (SMMF) method are given. The 3-D image and the elapsed time of a drill hole beneath the surface of graphite have also been described.
- INSTITUTE OF PURE AND APPLIED PHYSICSの論文
- 2003-05-15
著者
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Tamura Keimei
Department Of Electrical Engineering Kanazawa Technical College
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Kato Kyoko
Information And Computer Engineering Kanazawa Institute Of Technology
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Kanno Shohei
Optoelectronic Device System R & D Center Kanazawa Institute Of Technology
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Tokunaga Yoshiaki
Optoelectronic Device System R & D Center Kanazawa Institute Of Technology
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Tokunaga Yoshiaki
Optoelectronic Device System R&D Center, Kanazawa Institute of Technology, 7-1 Ohgigaoka, Nonoichi, Ishikawa 921-8501, Japan
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Kato Kyoko
Information and Computer Engineering, Kanazawa Institute of Technology, 7-1 Ohgigaoka, Nonoichi, Ishikawa 921-8501, Japan
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Okayama Toshinori
Optoelectronic Device System R&D Center, Kanazawa Institute of Technology, 7-1 Ohgigaoka, Nonoichi, Ishikawa 921-8501, Japan
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Okayama Toshinori
Optoelectronic Device System R&D Center, Kanazawa Institute of Technology, 7-1 Ohgigaoka, Nonoichi, Ishikawa 921-8501, Japan
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Kanno Shohei
Optoelectronic Device System R&D Center, Kanazawa Institute of Technology, 7-1 Ohgigaoka, Nonoichi, Ishikawa 921-8501, Japan
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