Phase Transformation of Single Crystalline Silicon by Scratching

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概要

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• The relationship between the phase transformation and the stress applied on single-crystalline silicon wafer was studied by performing a scratch test. The cracks and phases were observed by optical microscopy and micro Raman spectroscopy, respectively. Various silicon polymorphs and crack shapes were observed as functions of speed and direction of the scratching, respectively. Atomic force microscopy was also carried out to analyze the morphology of the scratch grooves.

• INSTITUTE OF PURE AND APPLIED PHYSICSの論文
• 2003-05-15

著者

• Jeong Seong-min

  Department Of Ceramic Engineering Yonsei University

• Lee Hong-lim

  Department Of Ceramic Engineering School Of Material Science And Engineering College Of Engineering

• Park Sung-eun

  Department Of Ceramic Engineering Yonsei University

• Oh Han-seog

  Department Of Ceramic Engineering School Of Material Science And Engineering College Of Engineering

• Park Sung-Eun

  Department of Ceramic Engineering, Yonsei University, 134 Shinchon-dong, Seodaemun-gu, Seoul 120-749, Korea

• Oh Han-Seog

  Department of Ceramic Engineering, Yonsei University, 134 Shinchon-dong, Seodaemun-gu, Seoul 120-749, Korea

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• A Comparative Study between Total Thickness Variance and Site Flatness of Polished Silicon Wafer : Semiconductors
• Phase Transformation of Single Crystalline Silicon by Scratching
• Crystallization Properties of Ge1-xSbx Thin Films ($x = 0.58{\mbox{--}}0.88$)
• Influence of Silicon Doping on the Properties of Sputtered Ge2Sb2Te5 Thin Film
• Atomistic Simulation on the Phase Transformation of Silicon under Nonhydrostatic Stress
• Determination of Effective Nanoindentation Range for Hard (Ti,Al)N Thin Film
• Phase Transformation of Single Crystalline Silicon by Scratching

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