Chlorine-Based Dry Etching of III/V Compound Semiconductors for Optoelectronic Application
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概要
- 論文の詳細を見る
Chlorine-based dry etching of III/V compound semiconductors for optoelectronic applications has been reviewed. The advantages of the ultrahigh-vacuum (UHV)-based electron cyclotron resonance (ECR)-plasma reactive ion beam etching (RIBE) over conventional RF-plasma reactive ion etching (RIE) were emphasized as the capability to use carbon-free, chlorine (Cl2) gas plasmas, controllability of ion energies and compatibility with other UHV-based chambers such as a molecular beam epitaxy (MBE) chamber. The RIBE technique was shown to exhibit excellent laser diode performances, such as extremely low threshold-current, high polarization-controllability and a lifetime of more than 3000 h for structures with more than 1-µm-wide etched-mesa width. The degree of etching-induced damage was evaluated in terms of the nonradiative surface recombination velocity Sr and the possibilities of practical applications of the dry-etched devices were discussed using the Sr values.
- INSTITUTE OF PURE AND APPLIED PHYSICSの論文
- 1998-02-15
著者
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Yoshikawa Takashi
Opto-Electronics Research Laboratories, NEC Corporation
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Nambu Yoshihiro
Opto-electronics Research Laboratories Nec Corporation
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ASAKAWA Kiyoshi
Tsukuba Laboratory, The Femtosecond Technology Research Association
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KOHMOTO Shigeru
Tsukuba Laboratory, The Femtosecond Technology Research Association
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Sugimoto Yoshimasa
Opto-electronics Research Laboratories Nec Corporation
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Kohmoto Shigeru
Tsukuba Laboratory, The Femtosecond Technology Research Association, 5-5 Tokodai, Tsukuba 300-26, Japan
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Sugimoto Yoshimasa
Opto-Electronics Research Laboratories, NEC Corporation, 34 Miyukigaoka, Tsukuba 305, Japan
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Nambu Yoshihiro
Opto-Electronics Research Laboratories, NEC Corporation, 34 Miyukigaoka, Tsukuba 305, Japan
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