Metal Chloride Reduction Chemical Vapor Deposition for Ta, Mo and Ir Films

概要

論文の詳細を見る
Tantalum, molybdenum and iridium thin films are deposited by metal chloride reduction chemical vapor deposition (MCR-CVD) process using Cl2 plasma. In the process, Cl2 plasma, which is generated between a substrate and a metal plate, produces volatile chlorides by chlorination of the metal plate and also acts as a reducing agent. A conformal coverage of the tantalum film on a patterned surface is observed. MCR-CVD using Cl2 plasma is expected to be applied to the deposition of extensive metals, whose chlorides exhibit reasonably high vapor pressures at low temperatures.
2004-01-15