三次元異材接合体界面端における臨界特異応力場の強さ（接着形状が矩形の場合）

概要

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We present a relationship between delamination force for a bonded structure and a new intensity parameter of stress singularity at vertex on interface. Delamination test is carried out using a specimen made of Silicon plates bonded by resin, and relationship between delamination force and resin thickness is investigated. In addition, the intensity of stress singularity is computed by stress distribution and order of singularity. Boundary element stress analysis and finite element eigen analysis are carried out for three dimensional models to obtain the stress distribution and order of singularity. In the stress analysis, mechanical load is considered as the boundary condition. The novelty point of this paper is that a new intensity parameter, i.e., a critical parameter of intensity of stress singularity, K3D1θθcritical was defined. Consequently, it was confirmed that there is a relationship between the practical delamination force F and the parameter K3D1θθcritical.