低温蒸着法によるAg, CuおよびPd薄膜の電気抵抗

概要

論文の詳細を見る
An experimental study of the electrical resistivities of Ag, Cu and Pd films is given. These films have been prepared by vapor-quenching on cold substrates at 77 K.<BR>The resistivities of Ag and Cu films exhibit no sharp decrease but show a gradual change with increasing temperature, which is the same characteristics with the results obtained by earlier workers.<BR>This is the first measurement of the resistivity in Pd thin films made by low temperature condensation. The resistivity of Pd films decreases abruptly around 185 K with increasing temperature. This sudden, irreversible drop in the resistivity indicates a transformation from an amorphous to a crystalline state. The experimental result of the resistivity in Pd films is in agreement with earlier observation of the transformation based on an electron diffraction study by Fujime.