超音波共振法による太陽電池セル用多結晶シリコンウェファの欠陥検査

概要

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Solar cells have been an attractive way to solve global energy and environmental problems so it have been commercially developed for decades. Among various solar cells, the one based on polycrystalline silicon wafer has been commonly used; however, the polycrystalline silicon wafer normally contains many mechanical defects such as cracks, chippings, holes, and dimples, which could deteriorate the performance of the solar cells.In the present research, the defects in polycrystalline silicon wafer are non-destructively investigated by a method of resonant ultrasound spectroscopy. The results of the modal analysis and the measurement of resonant frequency suggest an availability of the present method for the defect inspection.
埼玉大学総合研究機構地域オープンイノベーションセンターの論文