OS0807 中間層を有する異種接合材の熱応力負荷下での応力分布に関する検討(OS8-2 接合界面・接着,OS-8 機械の接合部・接触部のプロセスと疲労・強度問題2)

概要

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Free-edge stress singularity usually develops near the intersection of free surface and the interface of bonded dissimilar materials. To defuse the thermal stress that develops due to the difference of the coefficient of thermal expansion, an interlayer may be inserted between two materials. In this study, effects of the interlayer on stress singularity under thermal stress loading were investigated theoretically and numerically. It was found that the free-edge stress singularity disappeared by inserting a proper material into bonded dissimilar materials. The effects of interlayer on the stress distributions was limited in the small area of the order of interlayer thickness around the intersection of the interface and free-surface. Stress distribution calculated by B.E.M. can be normalized by using the exponent of stress singularity, the stress intensity factor and thermoelastic constant stress term of bonded dissimilar materials without an interlayer.
一般社団法人日本機械学会の論文
2011-07-16