722 Cohesive Zone Modeling of Cracking along the Cu/Si Interface in Nanoscale Thin Films

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概要

• 論文の詳細を見る
• 社団法人日本材料学会の論文
• 2011-05-24

著者

• Kitamura Takayuki

  Kyoto Univ. Kyoto Jpn

• Sumigawa Takashi

  Kyoto University Graduate School Of Engineering:mechanical Engineering Research Laboratory Hitachi L

• Yan Yabin

  Kyoto University

• Sumigawa Takashi

  Kyoto University

• Shang Fulin

  Xi'an Jiaotong University

関連論文

• Angular Distribution of Slip Steps by Three-Dimensional Polycrystalline Model for Stainless Steel
• Three-Dimensional Cohesive Zone Modeling on Interface Crack Initiation from Nanoscale Stress Concentration
• SA-09-3(043) Growth of Grain Boundary Cavity under Nabarro-Herring Creep(Flaw Progress & Failure Mechanism 2)
• Slip Behavior and Local Stress near Grain Boundary in High-Cycle Fatigue of Copper Polycrystal
• Ab Initio Simulation on Ideal Shear Strength of Silicon(Electronic Devices)
• Crack Propagation under Creep-Fatigue Interaction Condition
• 722 Cohesive Zone Modeling of Cracking along the Cu/Si Interface in Nanoscale Thin Films
• Analysis of Stress Distribution in Au Micro-Interconnection by Polycrystalline Models

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