Three-Dimensional Cohesive Zone Modeling on Interface Crack Initiation from Nanoscale Stress Concentration
スポンサーリンク
概要
- 論文の詳細を見る
In the previous study, crack initiation from a free edge along an interface between Cr microdot and SiO2/Si substrate was experimentally investigated and theoretically analyzed within the framework of fracture mechanics. Since the size of stress concentrated zone confined to a nanoscale, it was questionable whether the fracture mechanics was still valid or not. The cohesive zone model (CZM) has advantages in describing cracking behavior along an interface. However, its 3-D applicability in nanoscale components has not yet been investigated. In this study, a three-dimensional cohesive zone model of exponential type is used to extract the toughness for the crack initiation along the interface between Cr microdot and SiO2/Si substrate with the nanoscale stress concentration. After the CZM parameters for the Cr/SiO2 interface cracking are calibrated by an experiment, its validity is examined by other experiments. This study demonstrates the applicability of the three-dimensional CZM to the characterization of interface fracture behavior in nanoscale components.
著者
-
KITAMURA Takayuki
Kyoto University
-
YAN Yabin
Kyoto University, Department of Mechanical Engineering and Science, Kyoto University
-
SUMIGAWA Takashi
Kyoto University, Department of Mechanical Engineering and Science, Kyoto University
-
SHANG Fulin
Xi’ an Jiaotong University, Department of Engineering Mechanics, Xi’ an Jiaotong University
-
Kitamura Takayuki
Kyoto Univ. Kyoto Jpn
-
Yan Yabin
Kyoto University
-
Sumigawa Takashi
Kyoto University
-
SHANG Fulin
Xi' an Jiaotong University, Department of Engineering Mechanics, Xi' an Jiaotong University
関連論文
- Angular Distribution of Slip Steps by Three-Dimensional Polycrystalline Model for Stainless Steel
- Three-Dimensional Cohesive Zone Modeling on Interface Crack Initiation from Nanoscale Stress Concentration
- SA-09-3(043) Growth of Grain Boundary Cavity under Nabarro-Herring Creep(Flaw Progress & Failure Mechanism 2)
- Slip Behavior and Local Stress near Grain Boundary in High-Cycle Fatigue of Copper Polycrystal
- Ab Initio Simulation on Ideal Shear Strength of Silicon(Electronic Devices)
- Crack Propagation under Creep-Fatigue Interaction Condition
- 722 Cohesive Zone Modeling of Cracking along the Cu/Si Interface in Nanoscale Thin Films
- Analysis of Stress Distribution in Au Micro-Interconnection by Polycrystalline Models