Crack Propagation under Creep-Fatigue Interaction Condition

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概要

• 論文の詳細を見る
• 一般社団法人日本機械学会の論文

著者

• KITAMURA Takayuki

  Kyoto University

• Kitamura Takayuki

  Kyoto Univ. Kyoto Jpn

• Ohtani Ryuichi

  Kyoto University

関連論文

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• Slip Behavior and Local Stress near Grain Boundary in High-Cycle Fatigue of Copper Polycrystal
• Ab Initio Simulation on Ideal Shear Strength of Silicon(Electronic Devices)
• Crack Propagation under Creep-Fatigue Interaction Condition
• Small Crack Propagation in High Temperature Creep-Fatigue of 304 Stainless Steel
• 722 Cohesive Zone Modeling of Cracking along the Cu/Si Interface in Nanoscale Thin Films
• Analysis of Stress Distribution in Au Micro-Interconnection by Polycrystalline Models

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