A33 YAG高調波による単結晶シリコンの微細加工特性とその現象の検討(OS9 レーザ応用加工(3))

概要

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Monocrystalline silicon has played an important role as semiconductors in the electronical and the electrical industries. High efficiency and high quality manufacturing process of silicon is required for the continuous development of these fields. However, debris and cracks remained on machined surface by the traditional mechanical processing because of its high brittleness. On the other hand, laser beam machining could realize the high-speed processing. However, heat affected zone and dross remained in the case of fundamental wavelength of Nd:YAG laser. In comparison, it is expected that harmonics of Nd:YAG laser make it possible to perform the high precision micro-machining with small heat affected zone and crack because of its high photon energy. In this study, the influence of wavelength and surrounding pressure was investigated with observing process behavior using a high-speed shutter camera in micro-machining of monocrystalline silicon by fundamental wavelength and harmonics of Nd:YAG laser.
一般社団法人日本機械学会の論文
2010-11-19