D11 一括モールド型複合材料の高品位レーザ切断法の基礎的検討(OS-9 レーザ応用加工(1))

概要

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Laser cutting has been expected as a new dicing method of semiconductor package, since the laser beam processing can control the cut shape easily with a narrow kerf. However, since the distance between cutting edge and silicon chip becomes narrow according to the size reduction of semiconductor package, the laser dicing with low heat affected zone is required. In this study, laser cutting characteristics of solid type molded composite material with the cooled gas were experimentally investigated. The cooled gas flow from the side of a coaxial assist gas for laser beam led to straighter kerf shape and cut surface with low heat affected zone. The combination of coaxial assist gas and side cooled gas made it possible to obtain constant and narrow kerf width for various feed rates. Moreover, the difference of kerf width between irradiation side and exit side became smaller by supplying the side cooled gas.
社団法人日本機械学会の論文
2008-11-21