マルチ・ワイヤソー切断における砥粒径変化と切断機構に関する考察 : φ400mmシリコンインゴットの切断に関する研究(第3報)

概要

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This paper presents the method by which the change of abrasive grit size and the silicon particle size of multiwire saw slurry are measured quantitatively. The mechanism of wire saw slicing is discussed from a microscopic viewpoint based on the mea8urement results ; (1) GC abrasives and silicon particles are separated microscopic viewpoint each other by the suction filtering and chemical treatment technique. Their size distributions are measured by Coulter counter with 10% accuracy. (2) After slicing a 400mm-diameter ingot with 200mm in length, the consumed abrasives are e8timated to be approx. 7.0% in mass and 2.4% in number. On the other hand, silicon particle8 generated by the slicing range in 1 - 10μm diameter. (3) It is presumed as one of microscopic models of wire saw slicing that an indentation, a rolling and a scratching are actions of abrasives, and an effect of the scratching grows as the wire running speed increases.
公益社団法人精密工学会の論文
2001-06-05