1P1-L03 可変焦点ミラーを用いたはんだボール列実時間3次元計測システム(3次元計測/センサフュージョン)

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This paper describes a real-time system for measuring the three-dimensional shape of solder bumps arrayed on an LSI chip-size-package (CSP) board presented for inspection based on the shape-from-focus technique. It used a copper-alloy mirror defonned by a piezoelectric actuator as a varifocal mirror to build a simple, fast, precise and silent focusing-mechanism. Accurate measurements of bump height were achieved with errors of not more than 10 μm. This met the requirements for measuring coplanarity. A practical measuring speed of 1.7 s/chip for a small CSP (4 x 4 mm^2) was achieved by incorporating an exclusive FPGA processor to calculate focus measure and by building a domed array of LEDs as an illumination system with high intensity and uniformity so that a fast (150 fps) and high-resolution (1024 x 1024 pixels/frame) CMOS image sensor could be used.
一般社団法人日本機械学会の論文
2007-05-11