1107 引張圧縮負荷を受ける鉛フリーはんだの粘塑性有限要素解析(J08-1 電子情報機器,電子デバイスの強度・信頼性評価と熱制御(1) はんだ接合部信頼性,ジョイントセッション,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

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When we estimate the fatigue life of solder joints, we have to conduct FE analysis with a constitutive model which can exhibit dynamic property of Pb free solder. We proposed a creep-plasticity unified viscoplastic constitutive model with Armstrong-Frederick type nonlinear kinematic hardening rule which can describe temperature and rate dependent cyclic stress-strain relations. Then, we implemented the proposed model into finite element code MARC and analyzed tension tests and the tension-compression tests of Sn3.5Ag0.5Cu0.07Ni0.01Ge solder. We compared test data with analytical FE results of the proposed model, anand model and classical creep-prasticity decoupled model. It was confirmed that analytical results using the proposed model were in good agreements with the experimental results.
2008-08-02