はんだ接続点強度から見たリフローはんだ模擬方法の評価

概要

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Soldering method using thermo-blow heating is evaluated as a reflow soldering process simulation. Samples are prepared with various parameters such as solder metal (SnPb, SnAgCu, SnCuNiGe), soldering temperature (high, medium, low) and diameter of lead wire (thick, medium, fine). Pull strength test and the high temperature storage test are performed and be compared with the result of soldering method using a soldering iron.Experimental results are analyzed using the multivariable analysis. Pull strength test shows that an average strength of thermo-blow heating method is little less than that of soldering iron method, but a deviation of the former is larger than that of the latter by 37%. High temperature storage test shows that pull strength of allsamples prepared by both methods decreases with time. Especially the sample of SnAgCu prepared by thermo-blow heating method shows serious decreasing in pull strength. Week point of thermo-blow heating method is considered to be improved by shortening soldering working time.