Simulation and Experiment of Liquid-Phase Microjoining Using Cone-Shaped Compliant Bump
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概要
- 論文の詳細を見る
In order to meet the requirements of high-density interconnection in 3D-LSI, we have proposed easy-deforming compliant bumps (10μm-diameter/20μm-pitch) to lower the pressing load during bonding. But still, when the number of I/O connections approaches to or larger than 1,000,000, the pressing load becomes too heavier to be carried out by an available flip-chip bonder. The load problems of compliant bumps can be overcome by liquid phase bonding method. On the other hand, the shrinkage of bump pitch is restricted by the spread of melting solder as far as the existing bump technology is used. In this paper, this constraint can be overcome by using the cone-shaped compliant bump as a counter electrode of solder bump. We show experimental results together with simulation of fluid dynamics of molten solder.
- 社団法人電子情報通信学会の論文
- 2009-06-17
著者
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Asano Tanemasa
Department Of Electronics Graduate School Of Information Science And Electrical Engineering Kyushu U
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Qiu Li
Department Of Electronics Graduate School Of Information Science And Electrical Engineering Kyushu U
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Qiu Li
Department Of Cardiology The First Affiliated Hospital College Of Medicine Zhejiang University
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Watanabe Naoya
On leave from Fukuoka Industry, Science & Technology Foundation (Fukuoka IST)
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Watanabe Naoya
On Leave From Fukuoka Industry Science & Technology Foundation (fukuoka Ist)
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Asano Tanemasa
Department Of Computer Science And Electronics Kyushu Institute Of Technology
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