Effects of Si Addition and Heating Ar on the Electromigration Performance of Al-Alloy Interconnects
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 2002-02-15
著者
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Park Young
Process Development Team 2 System Ic R&d Center Hynix Semiconductor Inc.
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Kim Jin
Institute Of Basic Science University Of Ulsan
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Lee Jeong-gun
Process Development Team 2 System Ic R&d Center Hynix Semiconductor Inc.
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LEE Dok
Process Development Team 2, System IC R&D Center, Hynix Semiconductor Inc.
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LEE Byung-Zu
Process Development Team 2, System IC R&D Center, Hynix Semiconductor Inc.
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JEONG Jong
Process Development Team 2, System IC R&D Center, Hynix Semiconductor Inc.
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PARK Hyun
Process Development Team 2, System IC R&D Center, Hynix Semiconductor Inc.
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SHIM Kyu
Process Development Team 2, System IC R&D Center, Hynix Semiconductor Inc.
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KIM Jong
Process Development Team 2, System IC R&D Center, Hynix Semiconductor Inc.
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WOO Sun-Woong
Process Development Team 2, System IC R&D Center, Hynix Semiconductor Inc.
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Lee D
Process Development Team 2 System Ic R&d Center Hynix Semiconductor Inc.
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Woo S‐w
Process Development Team 2 System Ic R&d Center Hynix Semiconductor Inc.
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Shim Kyu
Process Development Team 2 System Ic R&d Center Hynix Semiconductor Inc.
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Lee Byung-zu
Process Development Team 2 System Ic R&d Center Hynix Semiconductor Inc.
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Jeong Jong
Process Development Team 2 System Ic R&d Center Hynix Semiconductor Inc.
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Park Young
Process Development 2 Semiconductor R&d Center Samsung Electronics
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Kim Jong
Process Development Team 2 System Ic R&d Center Hynix Semiconductor Inc.
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Park Hyun
Process Development Team 2 System Ic R&d Center Hynix Semiconductor Inc.
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WOO Sun-Woong
Process Development Team 2, System IC R&D Center, Hynix Semiconductor Inc.
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LEE Dok
Process Development Team 2, System IC R&D Center, Hynix Semiconductor Inc.
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