大型ウエハ対応・原子間力顕微鏡の研究 : 第2報,0.1nm分解能と25mm広域走査の両立(機械力学,計測,自動制御)
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概要
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We have developed a new AFM (Atomic force microscopy) for semiconductor device evaluation with high resolution of 0.1nm and wide-area measuring function to 25mm area using two scanning mechanisms, a piezoelectric XY scanner of 10μm stroke combined with an on-axis optical microscope and an ultra-flat XY stage of 200mm stroke moving on a reference plane with a static pressure guide or a contact friction guide switched to non-pressure. We demonstrated three operations, high-resolution mode with the piezoelectric scanner on the friction guide condition, middle-area mode from 5μm to 1mm area with the static pressure guide and 25mm wide-area mode with the friction guide. Finally, an atomic step of 0.3nm height, CMP (Chemical Mechanical Polishing) samples with 2-10mm measurement area and the flatness accuracy of 30nm/25mm were measured in one AFM.
- 2006-05-25
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- 大型ウエハ対応・原子間力顕微鏡の研究 : 第1報,粗微動併用XYステージの応用(機械力学,計測,自動制御)
- 大型ウエハ対応・原子間力顕微鏡の研究 : 第2報,0.1nm分解能と25mm広域走査の両立(機械力学,計測,自動制御)
- 高速走査AFM技術
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