界面強度向上のためのボンドコート材料の改善および溶射条件の検討(OS5-3 コーティング/基材の界面強度,OS5 コーティングプロセスとその皮膜特性評価)

概要

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Modification of the bond coating materials is one means to improve the bond strength of TBC. It was reported that TBC with CoNiCrAlY-CeSi bond coating had higher bond strength than conventional TBC (YSZ/CoNiCrAlY), because of the formation of discontinuous and rootlike TGO, and of thin and scattered Al_2O_3. However, the TGO formation mechanism for TBC with CoNiCrAIY-CeSi has not been cleared yet. In this study, the effects of Ce and Si addition and of the plasma current value during spraying bond coatings on TGO formation behavior were investigated. TGO formation behavior was different between TBC produced with a plasma current 600A and with 900A. TGO formation mechanisms for each case, 600A, 900A, were suggested by detailed investigation of initial oxide formation. It is supposed that the bond strength of TBC with CoNiCrAlY CeSi bond coating would be affected by plasma current. Accordingly, investigation of effects of the plasma current value on bond strength should be performed.
一般社団法人日本機械学会の論文
2004-07-20