小型筐体内におけるモデルパッケージからの複合伝熱(J01-5 筐体放熱設計,J01 エレクトロニクス実装における熱制御および信頼性評価)

概要

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This paper reports on measurements of conjugate heat transfer from a model package placed on a PCB located in a rectangular duct cooled by air. The model package used by the present experiment is isothermal model, which is composed of two copper plates sandwiching a foil heater and a heat flux sensor. The effects of the thermal conductivity of PCB and the other small heat sources around the model package on the conjugate heat transfer characteristics were studied experimentally. Using the concept of effective heat transfer area, a unique non-dimensional correlation is proposed, which can predict the maximum temperature for various thermal conductivity of PCB. The correlation is also applicable for two small heat sources around the package.
社団法人日本機械学会の論文
2004-09-04