Smart-Cut: A New Silicon On Insulator Material Technology Based on Hydrogen Implantation and Wafer Bonding

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概要

• 論文の詳細を見る
• 社団法人応用物理学会の論文
• 1997-03-30

著者

• Bruel Michel

  Leti-dmitec-cea

• ASPAR Bernard

  CEA Departement de Microtechnologies

• AUBERTON-HERVE Andre-Jacques

  LETI

• ASPAR Bernard

  G-I7

関連論文

• Smart-Cut: A New Silicon On Insulator Material Technology Based on Hydrogen Implantation and Wafer Bonding
• SMART-CUT^[○!R] : The Basic Fabrication Process for UNIBOND^[○!R] SOI Wafers (Special Issue on SOI Devices and Their Process Technologies)
• Smart-Cut : A New S.O.I. Material Technology Based on Hydrogen Implantation and Wafer Bonding

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