Smart-Cut : A New S.O.I. Material Technology Based on Hydrogen Implantation and Wafer Bonding

スポンサーリンク

概要

• 論文の詳細を見る
• 1996-08-26

著者

• Bruel Michel

  Leti-dmitec-cea

• AUBERTON-HERVE Andre-Jacques

  LETI

• ASPAR Bernard

  G-I7

• BRUEL MICHEL

  LETI/CEA Department de Microtechnologies

• ASPAR Bernard

  LETI/CEA Department de Microtechnologies

• AUBERTON-HERVE Andre-Jacques

  SOITEC

関連論文

• Smart-Cut: A New Silicon On Insulator Material Technology Based on Hydrogen Implantation and Wafer Bonding
• SMART-CUT^[○!R] : The Basic Fabrication Process for UNIBOND^[○!R] SOI Wafers (Special Issue on SOI Devices and Their Process Technologies)
• Smart-Cut : A New S.O.I. Material Technology Based on Hydrogen Implantation and Wafer Bonding

スポンサーリンク