Interrelation of Si Internal Stress and Si/SiO_2 Interface Stress
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概要
- 論文の詳細を見る
Both Si/SiO_2 interface stress (σ_<int>) and Si internal stress (σ_<si>) of identical CZ-Si wafers with oxidized SiO_2 film are estimated and analyzed. In the oxidation temperature from 1000 to 1100℃, temperature dependence of σ_<int> and σ_<si> is similar in the small warpage region, but quite different in the large warpage region. Furthermore, it is observed that the values of σ_<int> are one order of magnitude larger than those of σ_<si>. These experiments suggest that the relaxation phenomenon occurs near Si/SiO_2 interface, and the relaxation mechanism in the small warpage region differs from that in the large warpage region.
- 社団法人応用物理学会の論文
- 1984-09-20
著者
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Satoh Shiro
Semiconductor Research Laboratory Clarion Co. Ltd.
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IECHI Hiroyuki
Semiconductor Research Laboratory, Clarion Co., Ltd.
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Iechi Hiroyuki
Semiconductor Research Laboratory Clarion Co. Ltd.
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