Plasma Etching of SiO_2 Relief Having Tapered Wall
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1980-07-05
著者
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Komiya Hiroyoshi
Lsi Research And Development Laboratory Mitsubishi Electric Corporation
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ITAKURA Hideaki
Computer Development Laboratories Limited
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ITAKURA Hideaki
Cooperative Laboratories, VLSI Technology Research Association
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KOMIYA Hiroyoshi
Cooperative Laboratories, VLSI Technology Research Association
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TOYODA Hiroyasu
Cooperative Laboratories, VLSI Technology Research Association
関連論文
- Frequency Effect on Material Selectivity in Gas Plasma Etching in Planar Type Reactor
- Etching of SiO_2 in CF_4 Gas Plasma Using Planar-Type Reactor
- Plasma Etching of SiO_2 Relief Having Tapered Wall