8.ダスト形成に関するシミュレーション(<小特集>ダストプラズマの現状と課題)

概要

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A new particle simulation code is developed for studying the dynamics of the grains which are exposed to charging by the background plasma particles. Effects of regular attachment of electrons and ions, effects of secondary electron emission, and coagulation of grains are included in this code. Simulation results show that grains randomly change their charges from negative to positive, or from positive to negative in "flip-flop" fashion as a result of competition between the electron attachment and secondary electron emission. It is found that the flip-flop effect becomes remarkable when the radius of grains is of the order of 10 nm, because the attachment of a single electron to a grain is less effective on the surface potential for larger grains, while the average probability of electron attachment is smaller for smaller grains. Grains with opposite charges attract each other to coagulate, so that grains of size of 10 nm are likely to grow in size. The flip-flop effect is found to be essential to the growth of grains.
社団法人プラズマ・核融合学会の論文
1997-11-25