軟ろう接に関する研究(第 2 報)

概要

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In this report, authors have discussed the spreading phenomenon of solders on the Fe plate, Cu plate and BsP3 plate. The results obtained from this investigation are as follows. (1) The spread area of Sn-Pb solder on Cu and BsP3 plates is more increased by using ZnCl_2+SnCl_2. This is owing to make Cu-Sn alloy layer on above plates contacted with flux by adding SnCl_2. On the other hand the spread area of Sn-Pb solder on the Fe plate is decreased by adding SnCl_2 in ZnCl_2. (2) The spread area of tested solders on above plates is increased by using ZnCl_2+NH_4 Cl flux. It seems that increases of spread area is caused by HCl from heat dissolution of NH_4Cl. And increases of spread area is not affected greatly by reducing action of interfacial tension between solders and fluxes. (For example, value of interfacial tension between molten Sn and molten ZnCl_2+NaCl+NH_4Cl flux is nearly equal to molten Sn/ZnCl_2 interfacial tension value, nevertheless value of spread area of solder with ZnCl_2+NaCl+NH_4Cl is larger than ZnCl_2 flux.)(3) The spread area of 50% Sn-50% Pb solder is reduced by adding small quantity of Sb. (4) The flux turns into active by adding NH_4Cl in various fluxes, but addition of KCl, NaCl and KClNaCl have little effect.
社団法人溶接学会の論文
1969-11-25